Above Lending, Inc.

Company ID 604824241 Status Active

Above Lending, Inc. was incorporated as a Foreign For-profit Corporation on October 27, 2021, with its office address at 650 Dundee Road, Suite 150, Northbrook, IL 60062, United States and mailing address at "650 Dundee Road, Suite 150, Northbrook, IL 60062, United States". It is registered with the Delaware Division of Corporations and is authorized to conduct business in Washington. C T Corporation System serves as the registered agent. The company's directors are Tony Miles Ettinger, Laura Hamilton and Dustin Dewitt. The company is currently active. It has been operating for 3 years, 5 months and 25 days.

Contact

Mail Address

650 Dundee Road, Suite 150, Northbrook, IL 60062, United States

[email protected]

Telephone

Website

Go to website

Social Media

Basic Information

Updated: 2024-12-19

Company Name

Above Lending, Inc.

Company ID

604824241

Date of Registration

2021-10-27

Agent Information

Agent Name: C T Corporation System

Address: 711 Capitol Way S Ste 204, Olympia, WA 98501-1267, United States

Governing Persons

Officer/People

Name	Title
Tony Miles Ettinger Address: 118 W Edwards St Ste 200, Springfield, IL 62704-1927	Governor
Laura Hamilton Address: 118 W Edwards St Ste 200, Springfield, IL 62704-1927	Governor
Dustin Dewitt Address: 118 W Edwards St Ste 200, Springfield, IL 62704-1927	Governor

Tony Miles Ettinger

Address: 118 W Edwards St Ste 200, Springfield, IL 62704-1927

Title

Governor

Laura Hamilton

Address: 118 W Edwards St Ste 200, Springfield, IL 62704-1927

Title

Governor

Dustin Dewitt

Address: 118 W Edwards St Ste 200, Springfield, IL 62704-1927

Title

Governor

Gain a complete understanding of who truly controls a company by exploring its PSC (Persons with Significant Control), shareholders, and group structure.
*This section is pending updates and revisions.

Gain a complete understanding of who truly controls a company by exploring its PSC (Persons with Significant Control), shareholders, and group structure.

*This section is pending updates and revisions.